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| PREPARED BY: T&n DATE: / c 6/ qY DATE: / /b/P9 ELECTRONIC HARP COMPONENTS GROUP CORPORATION SPECNo. ISSUE PAGE REPRESENTAlIVE Opto-Ekctronic Ix5996031 Jun/16/99 (A 4Cl& APPROVED BY: J&l mq&za 10 pages DIVISION: Devices Division SPECIFICATION DEVICE SPECIFICATION FOR Light Emitting Diode MODEL No. GL5ZR302BOS 1. These specification sheets include materials protected under the copyright of Sharp Corporation ("Sharp"). Please do not reproduce or cause anyone to reproduce them without Sharp's consent. 2. When using this product, please observe the absolute maximum ratings and the instructions for use outlined in these specification sheets, as well as the precautions mentioned below. Sharp assumes no responsibility for any damage resulting from use of the product which does not comply with the absolute maximum ratings and the instructions included in these specification sheets, and the precautions mentioned below. (Precautions) (1) This products is designed for use in the following application areas; * Audio visual equipment * Home appliance * OA equipment * Telecommunication equipment (Terminal) * Measuring equipment * Tooling machines * Computers I r If the use of the product in the above application areas is for equipment listed in paragraphs (2) or (3). please be sure to observe the precautions given in those respective paragraphs. (2) Appropriate measures, such aa fail-safe design and redundant design considering the safety design of the overall system and equipment, should be taken to ensure reliability and safety when this product is used for equipment which demands high reliability and safety in function and precision, such as ; * Transportation control and safety equipment (aircraft, train, automobile etc.) * Gas leakage sensor breakers * Rescue and security equipment * Traftic signals I [ * Other safety equipment (3) Please do not use this product for equipment which require extremely high reliability and safety in function and precision, such as ; * Telecommunication equipment (for trutk lines) * Space equipment * Nuclear power control equipment * Medical equipment C (4) Please contact and consult with a Sharp sales representative if there are any questions regarding interpretation of the above three paragraphs. 3. Please contact and consult with a Sharp sales representative for any questions about this product. DATE: PRESENIED J(.l/YL BY: / /IS/ m I CUSTOMER'S APPROVAL `DATE: BY: M.Katoh, Department General Manager of Engineering Dcpt.,BI Opto-Electronic Devices Division Electronic Components Group SHARP CORPORATION DG!39603 1 MODEL No. GL5ZR302BOS Jud16/99 PAGE l/10 GL5ZR302BOS Soecification 1. Application This specification applies to the light emitting diode device Model No. GL5ZR302BOS. [AlGalnP (dicing or scribe/brake type) Red LED &vice] 2. Cuthne dimensions and pm co~e%!tions . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 2. 3. Ratings and characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 3-4. 3- 1. Absolute maximum ratings 3-2. Electra-optical characteristics 3-3. Derating Curve 3-4. Characteristics Diagram 4. Reliability . . . . . . . . . . . . . . . . . . . . . . . . . ..*........................... 4-l. Test items and test conditions 4-2. Measurement items and Faihue judgement criteria Refer to the attached sheet Page 5. 5. Incoming inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 6. 5- 1. Applied standard 5-2. Sampling method and level 5-3. Test items, judgement criteria and classifxa of defect 54. Test items the surface is be applied for flat type, judgement criteria and classifica of defect 6. Supplement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to the attached sheet Page 7-8. 6-1. Packing 6-2. Luminous intensity rank 6-3. Dominant wavelengthrank 6-4. Environment 7. Precautions use . . . . . . ..I...................................... for 7- 1. Lead forming method 7-2. Notice of installation 7-3. SolderingConditions `7-4. For cleaning Refer to the attached'sheet Page9- 10. DC89603 1 MODEL No. Jun/l6/99 PAGE 2. Outline dimensions and pin cormeetions 00 10r 18~s trvinqare~Y iI I i G 0 o . cd e A I II: I i j lt--lr iii iiIo iti. I x z 0. 5 +o. 1 ;;I pin connections 0. Anode 0: cathode p4ote) Umpecified tol. to be f0.2mm mote) Cold rolled steel leads are plated with but the tie-bar cut portions have no plating do not sol&r this part of the product. unit mm Material Lead : (Fe) Cold rolled steel Package : Epoxy resin Fiih Lead : Sn plated or wave soldering Drawing No. 51106012 lx99603 MODEL No. 1 Jun/16/9 PAGE GL5ZR302BOS 3/10 3. Ratingsandcharacteristics ' (Note 1) Duty ratio=1/1O,FUse width=O.lms (Note 2) At the positionof 1.6mmfrom the bottom resin package (Note 3) Refer to the suplement item 6. regardingthe standard rankclassification. of 3-3. DeratingCurve Peak Forward Current Derating Curve Forward Current Derating Curve a .5 e z t! 2 120 100 80 60 60 50 40 30 20 10 -25 0 Ambient 25 50 75 a510C TarC) 125 -25 0 Ambient 25 50 Temperature 75--100 Ta ("C) 125 Temperature \ DG99603 1 MODEL No. Jurl/16/99 PAGE 4110 GL5ZR302BOS Peak Forward Current vs. Duty Ratio (Ta=25"C) 10 l/100 l/10 Duty 1 10 OR Raito 3-4. Characteristics Diagram&p) Forward Current (Note 1) vs.Forward Voltage (Ta=25"C) Relative Luminous Intensity vs. Ambient Temperature ( I F=2OmA) 1000 loo t 1 1.2 1.4 Forward 1.6 1.8 Voltage 2 2.22.4 M(V) Frowrrd Voltage 2.6 -60 -40 -20 Ambient 0 20 40 Temprature 60 80 TarC). 100 120 Relative Lminour Intensity VS. (Ta=25"C) 1000 5, 2 ii z u: ea .a v 5 -l >" .% 2 100 10 1 0. 1 0. 01 0. 1 Forward 1 Current 10 IFhA) 100 (Note 1) Above characteristic data are typical data and not a gmrantteed data. DG99603 1 MODEL No. JLud16/9!I PAGE GL5ZR302BOS 5110 4. Reliability The reliability of productsshallbe satisfiedwith items listed below. L Cl. Test itemsandtestconditions Test items Solderability Soldering temperature Mechanical shock Variable frequency vibration Terminal strength (Tension) Terminal strength (Bending) Temperature cycling High temp. andhigh humidity storage Test conditions 230t5"C, 5s Prior disposition: Dip in rosin flux 260f5"C; 5s Confidencelevel: 90' Samples (n) LTPC Defective (C) @IO) n=ll, C=O n=ll, C=O n=ll, C=O n=ll.C=O n=ll,C=O n=ll, C=O n=22, C=O n=22. C=O n=22, C=O n=22, C=O n=22, C=O 20 20 20 20 20 20 10 10 10 10 10 15 OOOm/sz, 05ms, 3timesI 33SYptZ direction 2OOm/s*, to 2 000 to lOOHz/sweep 4min. 100 for ,4times/S&Y&Z direction Weight: ION, S/each terminal Weight:SN,O" + 90" --) O"* -90" + 0" /each terminal 40~(3Omin)~+100"c(3Omin),30 cycles Ta=+60"C, 9O%RH,t=lOOOh I!Iigh temperature storage Ta=lOO"C, t=lOOOh Low temperature storageTa=4O"c, t=lOOOh Operation life Ta=25"c, IFMAX. t=lOOOh*3 4-2. Measurement itemsandFailure judgementcriteria * 1 Measurement Forward voltage Reversecurrent Luminousintensity Symbol vF Failurejudgementcriteria *2 VF > U.S.L. x 1.2 IR > U.S.L. x 2.0 Iv > The first stagevalueX 2.0 or The first stagevalueX 0.5 > Iv IR Iv s Solderability : Soldershallbe adhere the areaof 95% or moreof dippedpotion. at g Terminal strength: Packageis not destroyed,and terminal is not slack. * 1: Measuringcondition is in accordance with specification. *2: U.S.L. is shownby UpperSpecificationLimit. *3: IF MAXis shownby forward current of absolute maximum ratings. DG99603 1 MODEL No. Jud16/95 PAGE GL5ZR302BOS 6110 5. Incoming inspection 5-1. Applied standard IS0 2859-l : 5-2. Samplingmethodandlevel : A single samplingplannormalinspection level II : AQI.. Major defect : 0.065% Minor defect : 0.4% 5-3. Test items, judgementcriteria and classilicaof defect No. 1 I Test items Disconnection I judgementcriteria Not emit light Different from dimension Different from dimension Not satisfy outline specification Over the limit value of specification V,, Ia, andIv at Exceed -0.2mm White point : Exceed $J 0.3mm (on top view) Black point : Exceed d 0.3mm (on top view) String form: Exceed 3.Omm(ontopview) Exceed Q0.3mmor O.lmm x l.Omm(on top view) Exceed @ 0.3mm (on top view) Extremely unevendensity Exceed MZrnm I from package center Minor defect Major defect :lassifica of deft 2I Positionof Cutting off Al Reverse terminal I 31 4 I 5I Outline dimensions I characteristics Cut off therim Foreignsubstance Scratch Void Unevendensityof materialfor scattering Unbalanced center BUlT Insertionpositionof terminal I I II 6 7 8 9 10 11 II 12 13 Exceed +0.2mmagainstprovided dimension Insertion positionof terminal 5-4. Test itemsthe surfaceis be applied for flat type, judgement criteria andclassificaof defect No. 14 15 Testitems Chapped surface the Hollow the surface I judgementcriteria The surfacechappedis striking for seethe lamptop The surfacehollow is striking for see lamptop the classifica of defec --J Minor defect DG99603 1 MODEL No. I GL5ZR302BOS Jun/16/99 PAGE 1 7110 6. Supplement 6-l. Packing 6-l-l. Inner package Put 25Opcs the same luminous intensity rank products into pack and put following label by pack. Product weight : 0.28g (One Product,Typ.) (Indication label sample) SHIPMENT TABLE PARTNo. GL5ZR302BOS - Modelnumber *o q q uuuu 250 - Quantity of products QUANTITY *Lotnumber* LOT No. KA99B19 05 0 0 0 Cl-0 tLuminousintensityrank dominantwavelengthrank SHARP' + Productioncountry MADE IN JAPAN 0 @ @) @ @ Productionplant code(tobe indicatedalphabetically) Supportcode Year of production(thelast two figures of the year) (to be indicatedalphabeticallywith Januarycorresponding A) to Month of production Date of production(01u 3 1) 6-l-2. Outer package Put 8 packs (the same luminousintensity rank) into outerpackage. (approximately 670g per oneouter package) 6-l-3. Outer package line dimension out Width: 14Omm,Depth: 225mm, I-I@: 9Omm (Ta=ZpC) 1Condition I 1 6-2.Luminousintensity rank (Note 1) Rank Luminousintensity 1 I 360 1 I 185 I 518 1 266 J K I 383 746 1. 552 ( 10751 Unit mcd I (Note 1) Tolerance:flS% In regardto luminousintensity , the following rankingshallbe carried out. However the quantity of eachrank shallnot be pre scribed. In caseof the distribution of the luminousintensity shift to high, at that point new upperrank is prescribedand lower rank is delete. 6-3.Dominantwavelengthrank (Note 2) Rank Dominant wavelength I 632.5 :Y 1 628.5 (Ta=2pC ) Condition Unit I I I (Note 2) The condition of measurementThe measurement the light emissionfrom the front sideof lamp. : of This rank value is the setting value of whenthat `classifies the rank and be not a guaranteevalue. it Also I shall not ask the delivery ratio of eachrank. 3 1 640.5 - b44.5 1 Ix996031 MODEL No. Jun/16/9!3 PAGE GL5ZR302BOS 8/10 6-4. EnviromIlent 641. Ozonosphere destructivechemicals. (1) The device doesn'tcontain following substance. (2) The device doesn'thave a productionline whoseprocess requiresfollowing substance. Restrictedpart: CFCs~ones,C~,Trichloroethane(Methych 642. Bromic non-burningmaterials The &vice doesn't contain bromic non-burningmaterials(PBBOs,PBBs) DG996031 MODEL No. JunA6/99 PAGE 1 7. Pnxautions for use 7 - 1. Lead forming method Avoid forming a lead pin with the lead pin base as a fulcrum:be sure to hold a lead pin firmly when forming. Lead pins should be formed before soldering. 7 - 2. Notice of installation 7-2-l installation on a P W B Vhen mounting an LEDlamp on a PIB,do not apply physical stress to the lead pins. The lead pin pitch should match the PIB pin-hole pitch:absolutely avoid widening or narrowing the lead pins. Ihen positioning an LEDlamp, basically employ an LEDwith tie-bar cut or use a spacer. 7-2-2 Whenan LED 1 is mounted directly on a P W B ' If the bottom face of an LED lamp is mounted directly on single-sided PW,the base of the lead pins may be subjected to physical stress due to PYBwarp,cutting or clinching of lead pins.Prior to use,be sure to check that no disconnection inside of the resin or damageto resin etc.,is found-Then an LED lamp is mounted on a double-sided PWB,theheat during soldering affects the resin;therefore.keep the LED lamp more that l.6mm afloat above the PWB. 7-2-3 Installation using a holder During an LED lamp positioning,when a holder is used,a holder should be designed not to subject lead pins to any undue stress. (Note)Pay attention to the thermal expansion coefficient of the material used for the holder.Since the holder expands and contracts due to preheat and soldering heat, mechanical stress may be applied to the lead pins, resulting in disconnection. 7-Z-4 Installation to the-case Do not fix part C with adhesives when fixed to the case as shown in Figure.A hole of the case should be designed not to subject the inside of resin to any undue stress. l l NG Good - fib 0 n . 611 ~ DG99603 1 MODEL No. Jud16/99 PAGE I lo/lo I GL5ZR302BOS 7 - 3. S oldering Conditions Solder the lead pins under the following conditions Conditions Type of Soldering 295"c+YC, within 3 seconds 1. Manual soldering 2. Wave soldering 26O"C+5"c. within 5 seconds Preheating 7O'c to 8O"C, within 30 seconds 3. Auto soldering 1 Soldering 245"ct-5"c, within 5 seconds 1 (Note) Avoid dipping resin into soldering bath. Avoid applying stress to lead pins while they are heated.For example when the LED lamp is moved with the heat applied to the lead pins dur Lg manual soldering or solder repair,disconnection may occur. I 7 - 4. For cleaning ( 1) Solvent cleaning : Solvent temperature 45C or less Immersion for 3 min or less (2 > Ultrasonic cleaning : The effect to device by ultrasonic cleaning differs by cleaning bath size,ultrasonic power output,cleaning time,PW size or device mounting condition etc. Please test it in actual using condition and confirm that doesn't occur any defect before starting the ultrasonic cleaning. ( 3 > Applicable solvent Ethyl alcohol. Methyl alcohol, Isopropyl alcohol In case when the other solvent is used,there are cases that the packaging resin is eroded. Please use the other solvent after thorough confirmation is performed-in actual using condition. |
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